JPS56120143A - Pressure insertion method - Google Patents

Pressure insertion method

Info

Publication number
JPS56120143A
JPS56120143A JP2304580A JP2304580A JPS56120143A JP S56120143 A JPS56120143 A JP S56120143A JP 2304580 A JP2304580 A JP 2304580A JP 2304580 A JP2304580 A JP 2304580A JP S56120143 A JPS56120143 A JP S56120143A
Authority
JP
Japan
Prior art keywords
pressure
cap
stem
insertion mold
nose
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2304580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239541B2 (en]
Inventor
Yoshinobu Mikazuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP2304580A priority Critical patent/JPS56120143A/ja
Publication of JPS56120143A publication Critical patent/JPS56120143A/ja
Publication of JPS6239541B2 publication Critical patent/JPS6239541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2304580A 1980-02-25 1980-02-25 Pressure insertion method Granted JPS56120143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2304580A JPS56120143A (en) 1980-02-25 1980-02-25 Pressure insertion method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2304580A JPS56120143A (en) 1980-02-25 1980-02-25 Pressure insertion method

Publications (2)

Publication Number Publication Date
JPS56120143A true JPS56120143A (en) 1981-09-21
JPS6239541B2 JPS6239541B2 (en]) 1987-08-24

Family

ID=12099475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2304580A Granted JPS56120143A (en) 1980-02-25 1980-02-25 Pressure insertion method

Country Status (1)

Country Link
JP (1) JPS56120143A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017216470A (ja) * 2017-07-21 2017-12-07 京セラ株式会社 To−can型パッケージ用ヘッダーおよび半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017216470A (ja) * 2017-07-21 2017-12-07 京セラ株式会社 To−can型パッケージ用ヘッダーおよび半導体装置

Also Published As

Publication number Publication date
JPS6239541B2 (en]) 1987-08-24

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